Publications

You can also find my papers on my Google Scholar profile.

Selected Papers

• [DATE] K. Zhu, D. Huang, L. Costero, and D. Atienza, “3D-ICE 4.0: Accurate and efficient thermal modeling for 2.5D/3D heterogeneous chiplet systems,” IEEE/ACM Design, Automation & Test in Europe Conference (DATE), 2026.

• [DATE] C. Wang, Z. Zhuang, K. Zhu, D. Huang, L. Costero, R. Chen, D. Atienza, and T.-Y. Ho, “ETLA-3D: Equivalent Thin Layer Aggregation based Thermal FEM for Hybrid Bonding F2F 3D ICs,” IEEE/ACM Design, Automation & Test in Europe Conference (DATE), 2026.

• [DAC] Q. Liu, D. Huang, M. Zapater, and D. Atienza, “GreenLLM: SLO-Aware Dynamic Frequency Scaling for Energy-Efficient LLM Serving,” ACM/IEEE Design Automation Conference (DAC), 2026.

• [CCGrid] A. Shahbazinia, D. Huang, L. Costero, and D. Atienza, “CloudFormer: An Attention-based Performance Prediction for Public Clouds with Unknown Workload,” IEEE/ACM International Symposium on Cluster, Cloud and Internet Computing (CCGrid), 2026.

• [arXiv] C. Wang, Z. Zhuang, S. Jiang, S. Liang, X. Yang, K. Zhu, D. Huang, L. Costero, R. Chen, T.-W. Huang, D. Atienza, and T.-Y. Ho. “CUTh-Solver: GPU-Accelerated Sparse Matrix Solver for High-Resolution Thermal Simulation of 3D ICs.” arXiv preprint arXiv:2606.17850 (2026).

• [arXiv] S. Machetti, P. D. Schiavone, L. Orlandic, D. Huang, D. Kasap, G. Ansaloni, and D. Atienza. “e-GPU: An Open-Source and Configurable RISC-V Graphic Processing Unit for TinyAI Applications.” arXiv preprint arXiv:2505.08421 (2025).

• [IEEE D&T] D. Atienza, K. Zhu, D. Huang, and L. Costero. “A 20-Year Retrospective on Power and Thermal Modeling and Management.” IEEE Design & Test, 2025.

• [TPDS] D. Huang, L. Costero, and D. Atienza, “An Evaluation Framework for Dynamic Thermal Management Strategies in 3D MultiProcessor System-on-Chip Co-Design,” IEEE Transactions on Parallel and Distributed Systems (TPDS), 2024.

• [CCGrid] D. Huang, L. Costero, and D. Atienza, “Is the powersave governor really saving power?,” 24th IEEE/ACM International Symposium on Cluster, Cloud and Internet Computing (CCGrid), 2024.

• [TSUSC] D. Huang, L. Costero, A. Pahlevan, M. Zapater, and D. Atienza, “CloudProphet: A Machine Learning-Based Performance Prediction for Public Clouds,” IEEE Transactions on Sustainable Computing (TSUSC), 2024.

• [TACO] Q. Liu, D. Huang, L. Costero, M. Zapater, and D. Atienza, “Intermediate Address Space: virtual memory optimization of heterogeneous architectures for cache-resident workloads,” ACM Transactions on Architecture and Code Optimization (TACO), 2024.

• [VLSI-SOC] R. Medina, D. Huang, G. Ansaloni, M. Zapater, and D. Atienza “REMOTE: Re-thinking Task Mapping on Wireless 2.5D Systems-on-Package for Hotspot Removal.” 31st IEEE Conference on Very Large Scale Integration (VLSI-SOC), 2023.

• [TCAD] D. Huang, A. Pahlevan, L. Costero, M. Zapater, and D. Atienza, “Reinforcement learning-based joint reliability and performance optimization for hybrid-cache computing servers,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2022.

• [ISCA Workshop] D. Huang, L. Costero, F. Terraneo, M. Zapater, and D. Atienza, “Accurate thermal modeling of heterogeneous multi-core processors,” HotSpots Strike Back Workshop on International Symposium on Computer Architecture, 2022.

• [TCAD] D. Huang, A. Pahlevan, M. Zapater, and D. Atienza, “COCKTAIL: Multicore co-optimization framework with proactive reliability management,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2021.

• [TODAES] H. Wang, T. Xiao, D. Huang, L. Zhang, C. Zhang, H. Tang, and Y. Yuan, “Runtime stress estimation for three-dimensional IC reliability management using artificial neural network,” ACM Transactions on Design Automation of Electronic Systems (TODAES), 2019.

• [TCAD] H. Wang, D. Huang, R. Liu, R. Liu, C. Zhang, H. Tang, Y. Yuan, “STREAM: Stress and thermal aware reliability management for 3-D ICs,” IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems (TCAD), 2018.